参数 | 数值 | 测试方法 |
---|---|---|
导热系数 (25°C) | 325 W/mK ±5% | ASTM E1461-13 |
抗拉强度 | 785 MPa | ISO 527-2:2012 |
热膨胀系数 | 2.3 ×10-6/K | DIN 53752-A |
* 所有数据基于3.2mm厚度试样的实验室测试结果
* 测试环境:23°C ±2°C,相对湿度50% ±5%
注意:本数据表内容可能随产品迭代更新,实际参数以最新版本QC/DS-2041 Rev.4为准
Story Source:
Materialsprovided byJohns Hopkins University Applied Physics Laboratory. Original written by Katie Kerrigan.Note: Content may be edited for style and length.
Journal Reference:
Jake Ballard, Matthew Hubbard, Sung-Jin Jung, Vanessa Rojas, Richard Ung, Junwoo Suh, MinSoo Kim, Joonhyun Lee, Jonathan M. Pierce, Rama Venkatasubramanian.Nano-engineered thin-film thermoelectric materials enable practical solid-state refrigeration.Nature Communications, 2025; 16 (1) DOI:10.1038/s41467-025-59698-y
2025-07-04